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Installation Report
DVIA-M Series
05-11-2026

YIMO BYD Semiconductor ZEISS Crossbeam 550 FIB-SEM DVIA-M1000 (240314R6) Installation Report

DVIA-M Series
Installation Report
YIMO
BYD Semiconductor
ZEISS
FIB-SEM
Crossbeam 550
DVIA-M1000
DVIA-ML1000
Chengdu

Overview

The DVIA-M1000 active vibration isolation platform is appropriately installed and functioning as intended.

Vibration Isolation System Information

Model: DVIA-M1000

Serial Number: 240314R6

Engineer

Chaewon Lee from DAEIL SYSTEMS

Tuning Date

August 06, 2024

Report written date

August 06, 2024

Number of Tuning Trial

1st tuning

Location

Chengdu, China

Equipment

Manufacturer: ZEISS

Equipment: FIB-SEM

Model: Crossbeam 550

Equipment Condition

The equipment is installed

Tuning Request

Data and Image

Vertical Transmissibility

Left to Right Transmissibility

Front to Back Transmissibility

Equipment picture

Reference

Generic Vibration Criteria

Criterion CurveDescriptionAmplitude
μm/s (µin/s)
Detail Size
μm
Workshop (ISO)Distinctly perceptible vibration. Appropriate to workshops and non-sensitive areas.800 (32,000)N/A
Office (ISO)Perceptible vibration. Appropriate to offices and non-sensitive areas.400 (16,000)N/A
Residential Area (ISO)Barely perceptible vibration. Appropriate to sleep areas in most instances.200 (8,000)75
Operating Theatre (ISO)Vibration not perceptible. Suitable for surgical suites, microscopes to 100x.100 (4,000)25
VC-AAdequate for optical microscopes to 400x, microbalances, optical balances.50 (2,000)8
VC-BAppropriate for inspection and lithography equipment to 3μm line widths.25 (1,000)3
VC-CAppropriate for optical microscopes to 1000x, lithography equipment to 1μm.12.5 (500)1 - 3
VC-DSuitable for demanding equipment including electron microscopes (SEMs/TEMs).6.25 (250)0.1 - 0.3
VC-EFor the most demanding systems including E-Beam lithography at nanometer scales.3.12 (125)< 0.1
VC-FFor extremely quiet research spaces. Not recommended as design criterion.1.56 (62.5)N/A
VC-GFor extremely quiet research spaces. Not recommended as design criterion.0.78 (31.25)N/A

Notes:

- As measured in one-third octave bands over 8-80 Hz (VC-A/B) or 1-80 Hz (VC-C through VC-G).

- Detail size refers to width in microelectronics fabrication or particle size in medical research.

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Case Study Information

Category
Installation Report
SeriesDVIA-M Series
Date05-11-2026
Tags
DVIA-M Series
Installation Report
YIMO
BYD Semiconductor
ZEISS
FIB-SEM
Crossbeam 550
DVIA-M1000
DVIA-ML1000
Chengdu